MF3NP/40 - Multifunction tool for outer sheath, bonded semiconductor and insulation

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø16 - 40 mm
  ø0.630 - 1.575 in
• To do what The MF3NP/60 tools enables the user to :
  Remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
  Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm / 1.57 inch
  Remove the insulation with a neat and straight cut
  
  Silicon required for the removal of bonded semiconductor
  
• Product benefits Tuning of the pitch of the tool
  
  
• Non peelable semiconductor screen thickness capacity 0.4 - 1.4 mm / 0.026 - .06 inch
• Insulation thickness capacity 7 mm / 0.28 inch
• Chamfer angle on the non peelable semiconductor screen 14.5°

Complementary tools

LHA - Tool to chamfer insulation

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