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CAMF4/40-90-BBCF - Multifunction tool for bonded semiconductor and insulation
Characteristics
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Options & complementary products
Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø40 - 90 mm
ø1.575 - 3.543 in -
To do what
The CAMF4/40-90-BBCF enables the user :
-To remove the bonded semiconductor
-To remove the insulation
The ball bearings in contact with the cable enable an easy rotation of the tool
Bonded semiconductor removal : Very steady (16 ball bearings rolling around the cable), shaping the cable round over the insulation , constant diameter over the insulation, prevent the blade from diging into the insulation, perform a chamfer on transition beetween the insulation and the semiconductor
Insulation removal : Back-iron that enables the user to tune the pitch of the tool thus making the rotation of the tool easy when removing the insulation
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Product benefits
No silicone
Ball bearings for an easier rotation of the tool
Low roughness over insulation
- Bonded semicon thickness capacity 2,5 mm / 0,098 in
- Remaining length of the semicon 55 mm / 2,165 in
- Insulation thickness capacity 35 mm / 1,378 in
Available options
K7/PNS4 - Blade support to make groove/slot
K7/SNS4 - To remove semiconductor with strainght transition beetween insulation and semi
Complementary tools
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Spare Parts
LFNS - Spare blade for bonded semiconductor
LINS - Spare blade for insulation
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