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CAMF5/55-160-BBCF - Multifunction tool for bonded semiconductor and insulation

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  • Spare Parts

  • Function(s) Remove the outer semi-conductor
    Remove the insulation
  • Diameter ø55 - 160 mm
    ø2.165 - 6.299 in
  • To do what The CAMF5-55-160 BBCF enables the user to :
    - remove the bonded semiconductor
    - remove the insulation

    Bonded semiconductor removal : very steady (16 ball bearings around the cable), shaping the cable round over the insulation, constant diameter over the insulation, prevent the blade from diging into the insulation

    Insulation removal : back-iron that enables the user to tune the pitch od the tool thus making the rotation of the tool easy when removing the insulaton

  • Product benefits No silicone
    Ball bearings for an easier rotation of the tool
    Low roughness over insulation
  • Bonded semicon thickness capacity 3 mm / 0,118 in
  • Remaining length of the semicon 80 mm / 3,150 in
  • Insulation thickness capacity 35 mm / 1,378 in
  • Spare Parts LFNS - Spare blade for bonded semiconductor
    LINS - Spare blade for insulation

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