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CMV-4F-PNP - 4 Functions MV case for peelable and non-peelable semiconductor

HTA
  • Characteristics

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  • Options & complementary products

  • In this kit

  • Spare Parts

  • Function(s) Cut / saw
    Remove the outer sheath
    Crimp connectors
    Work on the outer sheath
    Remove / work on the shield
    Remove the outer semi-conductor
    Remove the insulation
    Shape the insulation

    Tool kits overview
    Maintain / hang / fix cables
    Grounding
  • Diameter ø18 - 58 mm
    ø0.709 - 2.283 in
  • To do what CMV-4F-PNP case contains the tools necessary to remove the outer sheath, cut the peelable semiconductor, work on the bonded semiconductor and strip the insulation of cables

    An empty storage is included in order to complete the case with pliers PRG3 or chamfering stylus for insulation
  • Product benefits No silicon needed
    Compact case
  • Outer sheath Yes
  • Semi- conductor Peelable and bonded
  • Insulation Yes
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