CWB/12-44 - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø12 - 44 mm
  ø0.472 - 1.732 in
• To do what The CWB/12-44 enables the user to remove the bonded semicon with a chamfer on the semiconductor cutback
  
• Product benefits No silicon needed
  Fine tuning of the blade with a 'click' for each 1/10 mm
  Low roughness over insulation
  No Clamp stoper needed
  
• Thickness capacity 1,8 mm / 0,071 in
• Angle of the chamfer on the semiconductor 13°
• Remaining length of the semiconductor 25mm / 0,984 in
• Certifications Approved by ENEDIS

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