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CWB/12-44 - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback

HTA
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  • Function(s) Remove the outer semi-conductor
  • Diameter ø12 - 44 mm
    ø0.472 - 1.732 in
  • To do what The CWB/12-44 enables the user to remove the bonded semicon with a chamfer on the semiconductor cutback
  • Product benefits No silicon needed
    Fine tuning of the blade with a 'click' for each 1/10 mm
    Low roughness over insulation
    No Clamp stoper needed
  • Thickness capacity 1,8 mm / 0,071 in
  • Angle of the chamfer on the semiconductor 13°
  • Remaining length of the semiconductor 25mm / 0,984 in
  • Certifications Approved by ENEDIS
  • Spare Parts LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw

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