Accueil » MV cables tools » CWB/18-60-FEP

CWB/18-60-FEP - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback

  • Characteristics

  • Download

  • Pack

  • Options & complementary products

  • Spare Parts

  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation
    The CWB 18-60 works without silicone
  • Product benefits No silicon needed
    Fine tuning of the blade with a 'click' for each 1/10 mm
    Very smooth finish over the insulation
    Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
  • Thickness capacity 1,8 mm / 0,071 in
  • Angle of the chamfer on the semiconductor 13°
  • Remaining length of the semiconductor 25-30-40 mm / 0,984-1,181-1,575 in
  • Spare Parts LCWB-FEP - Spare blade for bonded semiconductor with chamfer 13°
    LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw

Get more information to spare parts by filling in the formular on this page

Add to basket
Want to know more?

Contact us

Thanks for fill in the below formular so that we can contact you