Accueil » MV cables tools » CWB/18-60-FEP
CWB/18-60-FEP - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
Characteristics
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Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø18 - 60 mm
ø0.709 - 2.362 in -
To do what
The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation
The CWB 18-60 works without silicone
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Product benefits
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Very smooth finish over the insulation
Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
- Thickness capacity 1,8 mm / 0,071 in
- Angle of the chamfer on the semiconductor 13°
- Remaining length of the semiconductor 25-30-40 mm / 0,984-1,181-1,575 in
Related kits
Available options
Complementary tools
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Spare Parts
LCWB-FEP - Spare blade for bonded semiconductor with chamfer 13°
LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw
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