Accueil » MV cables tools » CWB/18-60-FEP
CWB/18-60-FEP - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback
Characteristics
Download
Pack
Options & complementary products
Spare Parts
-
Function(s)
Remove the outer semi-conductor
-
Diameter
ø18 - 60 mm
ø0.709 - 2.362 in -
To do what
The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation
The CWB 18-60 works without silicone
-
Product benefits
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Very smooth finish over the insulation
Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
- Thickness capacity 1,8 mm / 0,071 in
- Angle of the chamfer on the semiconductor 13°
- Remaining length of the semiconductor 25-30-40 mm / 0,984-1,181-1,575 in
Related kits
Available options
Complementary tools
-
Spare Parts
LCWB-FEP - Spare blade for bonded semiconductor with chamfer 13°
LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw
Get more information to spare parts by filling in the formular on this page
Add to basket
Want to know more?
Contact us
Thanks for fill in the below formular so that we can contact you