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CWB/18-60-FEP - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback

HTA

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  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation
    The CWB 18-60 works without silicone
  • Product benefits No silicon needed
    Fine tuning of the blade with a 'click' for each 1/10 mm
    Very smooth finish over the insulation
    Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
  • Thickness capacity 1,8 mm / 0,071 in
  • Angle of the chamfer on the semiconductor 13°
  • Remaining length of the semiconductor 25-30-40 mm / 0,984-1,181-1,575 in
CWB1860FEP-GB.pdf

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  • Spare Parts LCWB-FEP - Spare blade for bonded semiconductor with chamfer 13°
    LCWB-FEP-V - Spare blade for bonded semiconductor with chamfer 13° + screw

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