CWB/18-60-FEP - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback

• Function(s) Remove the outer semi-conductor
  
• Diameter ø18 - 60 mm
  ø0.709 - 2.362 in
• To do what The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation
  The CWB 18-60 works without silicone
  
• Product benefits No silicon needed
  Fine tuning of the blade with a 'click' for each 1/10 mm
  Very smooth finish over the insulation
  Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
  
• Thickness capacity 1,8 mm / 0,071 in
• Angle of the chamfer on the semiconductor 13°
• Remaining length of the semiconductor 25-30-40 mm / 0,984-1,181-1,575 in

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