CWB/18-60-MVS - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback and stop for MV cable

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø18 - 60 mm
  ø0.709 - 2.362 in
• To do what The CWB/18-60 enables the user to easily remove the bonded semi-conductor without silicon and with a chamfer on the semicon cutback.
  The MVS sits on the cable to stop the CWB/18-60-MVS with a large contact surface.
  
• Product benefits No silicon needed
  Fine tuning of the blade with a 'click' for each 1/10 mm
  Very smooth finish over the insulation
  Achievement of a clean and straight semicon cutback
  
• Thickness capacity 1,8 mm / 0,071 in
• Angle of the chamfer on the semiconductor 13 °
• Remaining length of the semiconductor With MVS stop

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