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CWB/18-60-MVS - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback and stop for MV cable

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  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The CWB/18-60 enables the user to easily remove the bonded semi-conductor without silicon and with a chamfer on the semicon cutback.
    The MVS sits on the cable to stop the CWB/18-60-MVS with a large contact surface.
  • Product benefits No silicon needed
    Fine tuning of the blade with a 'click' for each 1/10 mm
    Very smooth finish over the insulation
    Achievement of a clean and straight semicon cutback
  • Thickness capacity 1,8 mm / 0,071 in
  • Angle of the chamfer on the semiconductor 13 °
  • Remaining length of the semiconductor With MVS stop

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