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CWB/18-60-MVS - Tool to remove bonded semiconductor with chamfer on the semiconductor cutback and stop for MV cable
Characteristics
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Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø18 - 60 mm
ø0.709 - 2.362 in -
To do what
The CWB/18-60 enables the user to easily remove the bonded semi-conductor without silicon and with a chamfer on the semicon cutback.
The MVS sits on the cable to stop the CWB/18-60-MVS with a large contact surface.
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Product benefits
No silicon needed
Fine tuning of the blade with a 'click' for each 1/10 mm
Very smooth finish over the insulation
Achievement of a clean and straight semicon cutback
- Thickness capacity 1,8 mm / 0,071 in
- Angle of the chamfer on the semiconductor 13 °
- Remaining length of the semiconductor With MVS stop
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