Accueil » MV cables tools » LCWB-SP2

LCWB-SP2 - Blade for bonded semi-conductor 8°

HTA

  • Characteristics

  • Download

  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The blade LCWB-SP2 fits the following products :

    CWB/18-60
    CWB/18-60-MVS-8
  • Thickness capacity 1,1mm / 0,043 in
  • Angle of the chamfer on the semiconductor 8°
LCWBSP2-GB.pdf
Add to basket
Want to know more?

Contact us

Thanks for fill in the below formular so that we can contact you