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CWE/14-50-MVS - Tool to remove peelable semiconductor and stop for MV cable
Characteristics
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Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø14 - 50 mm
ø0.551 - 1.969 in -
To do what
The CWE/14-50-MVS enables the user to score the peelable semiconductor, in order to remove it.
It performs a chamfer on the semicon cutback.
Its design enables to make circular, longitudinal and helicoidal cuts.
The MVS sits on the cable to stop the CWE/14-50 with a large contact surface.
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Product benefits
Fine tuning of the scoring depth
Chamfer on the transition
- Max scoring depth 1,4mm / 0,055 in
- Remaining length of semicon 10 mm / 0,394 in
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