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DSP - Tool to remove the peelable semiconductor
Characteristics
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Pack
Options & complementary products
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø10 - 80 mm
ø0.394 - 3.150 in -
To do what
The Dsp tool allows to remove and catch the peelable semiconductor at the end of cable to remove it by hand
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Product benefits
Remove the use of knife for a increased security
- Type of semiconductor Smooth peelable or ribbed
Related kits
Complementary tools
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