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GRI - Scraper for residues of bonded semiconductor screen.
Characteristics
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Pack
Options & complementary products
Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø15 - 240 mm
ø0.591 - 9.449 in -
To do what
The tool GRI enables the user to remove bonded semiconductor screen residus.
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Product benefits
Tool preset in factory safer than glass
- Certifications Approved by ENEDIS
Related kits
Available options
Complementary tools
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Spare Parts
LGR - Spare balde scrape semiconductor
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