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LASCR1 - Blade for bonded semiconductor

HTA
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  • Function(s) Remove the outer semi-conductor
  • Diameter ø14 - 60 mm
    ø0.551 - 2.362 in
  • To do what The blade LASCR1 fits the following products :

    MF1+/25 : 1 blade by tool
    MF+/60 : 1 blade by tooll
    ASC R1 : 1 blade by tool
    ASC R2 : 1 blade by tool
    ACS25R1 : 1 blade by tool
    ASC30R1 : 1 blade by tool
    ASC40R1 : 1 blade by tool
    BSC/25-40 : 1 blade by tool
    MF3NP/40 : 1 blade by tool
    MF3NP/60 : 1 blade by tool
  • Cutting depth 1,4 mm / 0,055 in
  • Certifications Approved by ENEDIS
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