Accueil » MV cables tools » LCWB-SP2

LCWB-SP2 - Blade for bonded semi-conductor 8°

HTA

  • Characteristics

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  • Function(s) Cut / saw
    Remove the outer sheath
    Crimp connectors
    Work on the outer sheath
    Remove / work on the shield
    Remove the outer semi-conductor
    Remove the insulation
    Shape the insulation

    Tool kits overview
    Maintain / hang / fix cables
    Grounding
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The blade LCWB-SP2 fits the following products :

    CWB/18-60
    CWB/18-60-MVS-8
  • Thickness capacity 1,1mm / 0,043 in
  • Angle of the chamfer on the semiconductor 8°
LCWBSP2-GB.pdf
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