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LHS2 - Tool for bonded non peelable semiconductor with silicone
Characteristics
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Options & complementary products
Spare Parts
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Function(s)
Remove the outer semi-conductor
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Diameter
ø38 - 60 mm
ø1.496 - 2.362 in -
To do what
The LHS2 enables the user to remove bonded semiconductor realizing a right stop.
Using the tool with silicone
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Product benefits
Back-iron to set the pitch of the tool in order to get a good result over the insulation
- Max cutting depth 5 mm / 0,197 in
Complementary tools
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Spare Parts
LASC2 - Blade for non-peelable semiconductor
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