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LHS2 - Tool for bonded non peelable semiconductor with silicone

HTA
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  • Spare Parts

  • Function(s) Remove the outer semi-conductor
  • Diameter ø38 - 60 mm
    ø1.496 - 2.362 in
  • To do what The LHS2 enables the user to remove bonded semiconductor realizing a right stop.
    Using the tool with silicone
  • Product benefits Back-iron to set the pitch of the tool in order to get a good result over the insulation
  • Max cutting depth 5 mm / 0,197 in
  • Spare Parts LASC2 - Blade for non-peelable semiconductor

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