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LHS3 - Tool for bonded non peelable semiconductor with silicone

HTB
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  • Spare Parts

  • Function(s) Remove the outer semi-conductor
  • Diameter ø60 - 80 mm
    ø2.362 - 3.150 in
  • To do what The LHS3 enables the user to remove bonded semiconductor realizing a right stop.
    Using the tool with silicone
  • Product benefits Back-iron to set the pitch of the tool in order to get a good result over the insulation
  • Max cutting depth 10 mm / 0,394 in
  • Spare Parts LASC3 - Blade for non-peelable semiconductor

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