Options & complementary products
Remove the outer semi-conductor
ø60 - 80 mm
ø2.362 - 3.150 in
To do what
The LHS3 enables the user to remove bonded semiconductor realizing a right stop.
Using the tool with silicone
Back-iron to set the pitch of the tool in order to get a good result over the insulation
- Max cutting depth 10 mm / 0,394 in
LASC3 - Blade for non-peelable semiconductor
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