LHS4 - Tool for bonded non peelable semiconductor with silicone

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø80 - 110 mm
  ø3.150 - 4.331 in
• To do what The LHS4 enables the user to remove bonded semiconductor realizing a right stop.
  Using the tool with silicone
  
• Product benefits Back-iron to set the pitch of the tool in order to get a good result over the insulation
  
• Max cutting depth 12 mm / 0,473 in

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