Accueil » MV cables tools » MF1/25-EP
MF1/25-EP - Tool for bonded semiconductor
Characteristics
Download
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø10 - 30 mm
ø0.394 - 1.181 in -
To do what
The MF1/25-EP realizes a helical incision of semiconductor of cables to take it off by hand
Incision of semiconductor with realization of stop chamfer
Tool provided with SRC stylus
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Product benefits
Righ and without tails helical incision
Minimal remaining length of 25 mm / 0,984 in
- Thickness capacity 0,4-1,5 mm / 0,016-0,065 in
- Remaining length of the semiconductor 25-30-40-45 mm / 0,984- 1,181- 1,575- 1,772 in
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