MF1+/60 - Multifunction tool for bonded semiconductor

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø18 - 60 mm
  ø0.709 - 2.362 in
• To do what The MF1+/60 is a multifunction tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
  Stylus in option score the peelable semiconductor or chamfer the insulation
  
  Silicone required for non peelable semiconductor
  
• Product benefits Smooth finishing over insulation
  Sliding thrust embeded in the tools to set semiconductor remaining length
  Fine tuning of blade with a 'click' for each 1/10 mm
  
• Thickness capacity 0,4-1,4 mm / 0,016-0,055 in
• Angle of the chamfer on the semiconductor 14,5°
• Remaining length of the semiconductor 30-40-45-50-55 mm / 1,181- 1,575- 1,772- 1,969- 2,165 in
• Certifications Approved by ENEDIS

Related kits

Available options

Complementary tools