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MF3NP/40 - Multifunction tool for outer sheath, bonded semiconductor and insulation

HTA
  • Characteristics

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  • Spare Parts

  • Function(s) Remove the outer sheath
    Remove the outer semi-conductor
    Remove the insulation
  • Diameter ø16 - 40 mm
    ø0.630 - 1.575 in
  • To do what The MF3NP/60 tools enables the user to :
    Remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
    Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm / 1.57 inch
    Remove the insulation with a neat and straight cut

    Silicon required for the removal of bonded semiconductor
  • Product benefits Tuning of the pitch of the tool

  • Non peelable semiconductor screen thickness capacity 0.4 - 1.4 mm / 0.026 - .06 inch
  • Insulation thickness capacity 7 mm / 0.28 inch
  • Chamfer angle on the non peelable semiconductor screen 14.5°

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