LASCR1 - Blade for bonded semiconductor

• Function(s) Remove the outer semi-conductor
  
• Diameter ø14 - 60 mm
  ø0.551 - 2.362 in
• To do what The blade LASCR1 fits the following products :
  
  MF1+/25 : 1 blade by tool
  MF+/60 : 1 blade by tooll
  ASC R1 : 1 blade by tool
  ASC R2 : 1 blade by tool
  ACS25R1 : 1 blade by tool
  ASC30R1 : 1 blade by tool
  ASC40R1 : 1 blade by tool
  BSC/25-40 : 1 blade by tool
  MF3NP/40 : 1 blade by tool
  MF3NP/60 : 1 blade by tool
  
• Cutting depth 1,4 mm / 0,055 in
• Certifications Approved by ENEDIS

Related kits

CNPT/630-2016 - Full kit for distribution underground cable 50 mm² up to 630 mm²

See the kit

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CKM-HTA-240-NG - Case for self service kit for MV 240 NG case

CKM-HTA-630-NG - Case for self service kit for MV 630 NG case

LASC25-40R2 -

CKM-HTA - Case for self service kit