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MTLP3 - Peelable semi-conductor incision blade
Characteristics
Download
-
Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
-
Diameter
ø60 - 80 mm
ø2.362 - 3.150 in -
To do what
The MTLP3 blade can be mounted on the following tools:
LHM3R: 1 blade per tool
- Depth of cut according to the tool
Add to basket
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