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ORACL - Tool to perform controlled longitudinal scoring on peelable semiconductor

HTA
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  • Function(s) Remove the outer semi-conductor
  • Diameter ø10 - 100 mm
    ø0.394 - 3.937 in
  • To do what The ORACL enables the user to score longitudinaly the peelable semiconductive layer in order to peel it off by hand.
    Adjustable scoring depths (0.4 / 0.6 / 0.9 / 1.1 mm)
  • Product benefits 4 adjustable scoring depth
    Easy catch of the semicon
    Light

  • Scoring depth 0.4 / 0.6 / 0.9 / 1.1 mm 0.016 / 0.024 / 0.035 / 0.043 inch
  • Min remaining length 10 mm
  • Spare Parts LSO - Spare blade for peelable semiconductor

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