ORACL - Tool to perform controlled longitudinal scoring on peelable semiconductor

• Function(s) Cut / saw
  Remove the outer sheath
  Crimp connectors
  Work on the outer sheath
  Remove / work on the shield
  Remove the outer semi-conductor
  Remove the insulation
  Shape the insulation
  
  Tool kits overview
  Maintain / hang / fix cables
  Grounding
  
• Diameter ø10 - 100 mm
  ø0.394 - 3.937 in
• To do what The ORACL enables the user to score longitudinaly the peelable semiconductive layer in order to peel it off by hand.
  Adjustable scoring depths (0.4 / 0.6 / 0.9 / 1.1 mm)
  
• Product benefits 4 adjustable scoring depth
  Easy catch of the semicon
  Light
  
  
• Scoring depth 0.4 / 0.6 / 0.9 / 1.1 mm 0.016 / 0.024 / 0.035 / 0.043 inch
• Min remaining length 10 mm / jacket - 4mm / screen

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