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LASCR1 - Blade for bonded semiconductor
Characteristics
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Pack
Options & complementary products
-
Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
-
Diameter
ø14 - 60 mm
ø0.551 - 2.362 in -
To do what
The blade LASCR1 fits the following products :
MF1+/25 : 1 blade by tool
MF+/60 : 1 blade by tooll
ASC R1 : 1 blade by tool
ASC R2 : 1 blade by tool
ACS25R1 : 1 blade by tool
ASC30R1 : 1 blade by tool
ASC40R1 : 1 blade by tool
BSC/25-40 : 1 blade by tool
MF3NP/40 : 1 blade by tool
MF3NP/60 : 1 blade by tool
- Cutting depth 1,4 mm / 0,055 in
- Certifications Approved by ENEDIS
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