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MF1+/60 - Multifunction tool for bonded semiconductor
Characteristics
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Options & complementary products
Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø18 - 60 mm
ø0.709 - 2.362 in -
To do what
The MF1+/60 is a multifunction tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
Stylus in option score the peelable semiconductor or chamfer the insulation
Silicone required for non peelable semiconductor
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Product benefits
Smooth finishing over insulation
Sliding thrust embeded in the tools to set semiconductor remaining length
Fine tuning of blade with a 'click' for each 1/10 mm
- Thickness capacity 0,4-1,4 mm / 0,016-0,055 in
- Angle of the chamfer on the semiconductor 14,5°
- Remaining length of the semiconductor 30-40-45-50-55 mm / 1,181- 1,575- 1,772- 1,969- 2,165 in
- Certifications Approved by ENEDIS
Related kits
Available options
PCR2 - Quick set up right angled 45° handle
Complementary tools
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Spare Parts
LASCR1 - Spare blade for bonded semiconductor
PER - Quick set up right angled 90° handle
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