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LCWB-FEP - Blade for bonded semi-conductor 13°

HTA

  • Characteristics

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  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The blade LCWB-FEP fits the following products :

    CWB/12-44
    CWB/18-60-MVS
  • Product benefits Very smooth result over insulation
    Neat and chamfered semicon cutback
  • Thickness capacity 1,8mm / 0,071 in
  • Angle of the chamfer on the semiconductor 13°
LCWBFEP-GB.pdf

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