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LSO - Blade for cutting the peelable semiconductor of MV cables

HTA

  • Characteristics

  • Function(s) Cut / saw
    Remove the outer sheath
    Crimp connectors
    Work on the outer sheath
    Remove / work on the shield
    Remove the outer semi-conductor
    Remove the insulation
    Shape the insulation

    Tool kits overview
    Maintain / hang / fix cables
    Grounding
  • Diameter ø10 - 100 mm
    ø0.394 - 3.937 in
  • To do what The blade LSO fits the following products :

    ORACL
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