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CMV-3F-PGNP - 3 Functions MV case for bonded semiconductor

HTA
  • Characteristics

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  • Spare Parts

  • Function(s) Remove the outer sheath
    Remove the outer semi-conductor
    Remove the insulation
    Tool kits overview
  • Diameter ø38 - 75 mm
    ø1.496 - 2.953 in
  • To do what CMV-3F-PGNP case contains the tools necessary to remove the outer sheath, work on the bonded semiconductor and strip the insulation of cables

    Diameter capacity :
    PRG4/C25-L283335 : Ø47 - 75mm (Ø1,850 - 2,953 in)
    CWB/18-60-FEP : Ø18 - 60mm (Ø0,709 - 2,362 in)
    LH2 : Ø38 - 60mm (Ø0,709 - 1,496 in)
  • Product benefits No silicon needed
    Compact case
  • Outer sheath Yes
  • Semi- conductor Bonded
  • Insulation Yes
  • Spare Parts LCWB-FEP - Spare blade for bonded semiconductor with chamfer 13°
    MTC4/25 - Spare blade for circular cutting 2,5 mm / 0,098 in (x4)
    TRL/28-33-35 - Spare interchangeable longitudinal cutting head for PRG3/2233
    LAC2 - Spare blade for insulation

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