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GRI - Scraper for residues of bonded semiconductor screen.

HTA
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  • Function(s) Remove the outer semi-conductor
  • Diameter ø15 - 240 mm
    ø0.591 - 9.449 in
  • To do what The tool GRI enables the user to remove bonded semiconductor screen residus.
  • Product benefits Tool preset in factory safer than glass
  • Certifications Approved by ENEDIS
  • Spare Parts LGR - Spare balde scrape semiconductor

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