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LHS4 - Tool for bonded non peelable semiconductor with silicone

HTB

  • Characteristics

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  • Spare Parts

  • Function(s) Remove the outer semi-conductor
  • Diameter ø80 - 110 mm
    ø3.150 - 4.331 in
  • To do what The LHS4 enables the user to remove bonded semiconductor realizing a right stop.
    Using the tool with silicone
  • Product benefits Back-iron to set the pitch of the tool in order to get a good result over the insulation
  • Max cutting depth 12 mm / 0,473 in
LHS4-GB.pdf

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  • Spare Parts LASC4 - Blade for non-peelable semiconductor

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