Options & complementary products
Remove the outer semi-conductor
ø80 - 110 mm
ø3.150 - 4.331 in
To do what
The LHS4 enables the user to remove bonded semiconductor realizing a right stop.
Using the tool with silicone
Back-iron to set the pitch of the tool in order to get a good result over the insulation
- Max cutting depth 12 mm / 0,473 in
LASC4 - Blade for non-peelable semiconductor
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