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MF1/25-EP - Tool for bonded semiconductor

HTA
  • Characteristics

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  • Function(s) Remove the outer semi-conductor
  • Diameter ø10 - 30 mm
    ø0.394 - 1.181 in
  • To do what The MF1/25-EP realizes a helical incision of semiconductor of cables to take it off by hand

    Incision of semiconductor with realization of stop chamfer
    Tool provided with SRC stylus
  • Product benefits Righ and without tails helical incision
    Minimal remaining length of 25 mm / 0,984 in
  • Thickness capacity 0,4-1,5 mm / 0,016-0,065 in
  • Remaining length of the semiconductor 25-30-40-45 mm / 0,984- 1,181- 1,575- 1,772 in
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