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MF3NP/40 - Multifunction tool for outer sheath, bonded semiconductor and insulation
Characteristics
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Options & complementary products
Spare Parts
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Function(s)
Cut / saw
Remove the outer sheath
Crimp connectors
Work on the outer sheath
Remove / work on the shield
Remove the outer semi-conductor
Remove the insulation
Shape the insulation
Tool kits overview
Maintain / hang / fix cables
Grounding
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Diameter
ø16 - 40 mm
ø0.630 - 1.575 in -
To do what
The MF3NP/60 tools enables the user to :
Remove the outer sheath (PE-PVC-PR) with a straight and neat cut.
Remove the bonbed semiconductor with a chamfer and a minimum remaining length of semiconductor of 40 mm / 1.57 inch
Remove the insulation with a neat and straight cut
Silicon required for the removal of bonded semiconductor
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Product benefits
Tuning of the pitch of the tool
- Non peelable semiconductor screen thickness capacity 0.4 - 1.4 mm / 0.026 - .06 inch
- Insulation thickness capacity 7 mm / 0.28 inch
- Chamfer angle on the non peelable semiconductor screen 14.5°
Complementary tools
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Spare Parts
PCR - Quick set up right angled 45° handle
196855 - Straight handle M10
108098 - Clamping knob for blade
LASCR1 - Spare blade for bonded semiconductor
LMF2 - Spare blade for primary insulation
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