Accueil » MV cables tools » MF1+/60

MF1+/60 - Multifunction tool for bonded semiconductor

HTA
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  • Spare Parts

  • Function(s) Remove the outer semi-conductor
  • Diameter ø18 - 60 mm
    ø0.709 - 2.362 in
  • To do what The MF1+/60 is a multifunction tool that enables the user to shave the bonded semiconductor at the desired length with a chamfer on the semiconductor cutback
    Stylus in option score the peelable semiconductor or chamfer the insulation

    Silicone required for non peelable semiconductor
  • Product benefits Smooth finishing over insulation
    Sliding thrust embeded in the tools to set semiconductor remaining length
    Fine tuning of blade with a 'click' for each 1/10 mm
  • Thickness capacity 0,4-1,4 mm / 0,016-0,055 in
  • Angle of the chamfer on the semiconductor 14,5°
  • Remaining length of the semiconductor 30-40-45-50-55 mm / 1,181- 1,575- 1,772- 1,969- 2,165 in
  • Certifications Approved by ENEDIS

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